As we all know, artificial intelligence is rapidly changing the world. But artificial intelligence solutions are just beginning and have great growth potential. Even in the early days of artificial intelligence, artificial intelligence has penetrated into every corner of our life in many different ways. From super-large-scale data centers to our homes and cars, to our personalized devices, such as mobile phones and wearable devices, we can find diverse AI applications of different sizes.


　　These diverse AI applications require diverse computational requirements and technical requirements, while facing different boundary conditions and technical barriers that need to be overcome. no single solution can meet all the requirements. it is therefore important to provide the correct computational solutions it requires for a given type of AI application.

　　Obviously, computing power itself is crucial to the realization of artificial intelligence. AI computing architecture has been evolving. Universal CPU is the most flexible computing solution for AI applications, but it does not optimize the computing operations needed in AI applications.

　　Later, GPU became very popular in AI type applications because they were more efficient in handling AI type calculations. Now, AI processors (custom-designed AI processors) with custom designs can achieve higher computational efficiency, and we believe this is the future of AI computing.

　　Universal CPU can be seen to dominate today's data center reasoning (Inference) application market, but custom AI chips are expected to account for nearly half of the market by 2025.

　　On the other hand, the training (Training) application market in data centers is currently entirely dominated by GPU, but by 2025, the most important solution in this market will be the latest trend in custom AI chips, silicon wafer technology, which may be important for AI applications and heterogeneous integration (heterogeneous Integration), contrary to the traditional direction of semiconductor industry —— that is, more and more content integrated into individual chips.


　　To adapt to the high demand and competitive chip market in the AI era, we need not only all kinds of silicon technology, but also excellent design IP. But in fact, few domestic companies can provide these excellent technical services.

　　Provides a variety of memory interfaces IP, up to 56 G of Serdes IP, high-speed interfaces and interface serial and parallel types. What is worth mentioning is that in addition to RenhotecIC international advanced level of independent technology, but also more suitable for AI chip customization needs, one-step turnkey rapid integration, as well as personalized full-process customization solutions, The whole process for domestic chips successfully escort, accelerate AI enterprise product design and landing.